Products

General Capabilities

Fine Line Imaging - 50µm pitch (25µm Traces / 25µm Spaces)
Microvias - 25µm - 100µm laser thru-vias
Polyimide thickness – 12.5µm - 75µm
Flex Base Material (Adhesive-less)
- Sputtered Base Material (2µm-18µm Cu thickness – 12.5,25,50µm Polyimide)
- Espanex (9,12,18,25,35µm Cu thickness – 12.5,25,50µm Polyimide)
- Dupont AP, Kapton E,H (5,9,12,18,35µm Cu thickness – 25,50µm Polyimide)
- Panasonic, Upilex, and other Asian materials
Metal Layer Count - 1 to 4 layers
Soldermask LPI Capability - 20µm - 75µm (Halogen free)
Coverlay and Adhesive thicknesses – 12.5µm - 75µm
UV and Co2 Laser capability
Surface Plating
- Electroless Cu
- Electrolytic Cu
- Electrolytic Nickel and Gold plating (Soft)
- ENIG – Electroless Ni – Immersion Gold
- HASL (Hot air solder leveling)
- Immersion Tin
- Immersion Silver
- Organic Solderability Preservative
Value Added Processing
- Component Assembly – Lead free solder
- Stiffeners and Reinforcement
- RFI shielding and Grounding (noise reduction)
- Partnered with local CM’s (contract manufacturing)

Services

Process Parameters

Drilling Mode

Thru and Blind via drilling of Copper and Polyimide material

Via Diameter

20µm - 200µm

Hole Position Accuracy

±25µm

Tooling Plate

Precision Vacuum plate w / Multi line pin system

Laser Types

UV Laser 355nm, diode-pumped, all solid-state
CO2 Laser, 9600nm, Sealed, RF-excited, super-pulsed

Capabilities Road Map

Basic

Advanced

R&D

Comments

Imaging

Min Pitch -
Trace / Space

100µm - 50µm / 50µm

75µm - 38µm / 38µm

60µm - 30µm / 30µm

Copper Thickness Dependant

Smallest Feature

75µm - 50µm

35µm

25µm

Pad to Via Ratio

5 : 1

4 : 1

3 : 1

Registration
Layer 1 to Layer 2

< 100µm

< 80µm

< 70µm

Microvias

Via Size

100µm - 75µm

50µm

25µm

Copper Thickness Dependant

Layers

1-2 Layers

3-4 Layers

4-5 Layers

Thru Via Only

Materials

Plated Copper

3µm - 50µm

2µm - 50µm

Copper Thickness

ED 5µm, 9µm,
12µm, 18µm, 25µm

RA only if req'd

Polyimide

12µm, 25µm,
50µm 75µm 125µm

Acrylic Adhesive

12µm, 25µm, 50µm

Pyralux Coverlay Film

12µm, 25µm, 50µm

Soldermask - DSFM

25µm - 50µm

20µm - 25µm

15µm - 20µm

Stiffeners

FR4, Polyimide, BT

Multilayer

Active Layers

1-2 Layers

3-4 Layers

4-5 Layers

Layer to Layer Tolerance

100µm - 75µm

75µm - 60µm

50µm - 35µm

Via Type

Thru

Plating

Electroless Copper

> 75µm via

> 50µm via

> 25µm via

Electrolytic Copper

> 4µm to desired thickness

> 2µm to desired thickness

Electrolytic Nickel

to desired thickness

Electrolytic Soft Gold (wire bondable)

to desired thickness

Selective Plating on (Cu, Ni, Au)

Yes

Electrolytic Tin

to desired thickness

ENIG -
Electroless Nickel / Immersion Gold

Yes

HASL

Yes

Singulation

Steel Rule Die (SRD) Tolerances

± 125µm

UV and Co2 Laser Machining Tolerances

75µm-50µm

50µm-38µm

38µm-25µm

Thickness Dependant

Slits / Slots / Small Features

75µm-50µm

50µm-38µm

38µm-25µm

Thickness Dependant

Laser Processing

Co2 Laser / Plasma Etching

Polyimide / Adh.
12µm, 25µm, 50µm

12µm, 25µm, 50µm

Polyimide Etching - Chemical

2010

Assembly

HASL

Yes

Connectors

Yes

Lead Free Solder

Yes

Passive Components

Yes

Stiffeners / Reinforcement

FR4, BT, Kapton

Shielding

Cu 5µm, 9µm,
12µm, 18µm, 25µm

Folding / Pre-Assembly

Yes

Quality

Visual Inspection

Up to 50x

Auto Optical Inspection (AOI)

2010

Electrical Test

Yes

X-Section

Yes

Optical Measurement System

± 10µm

± 5µm

Automated Dimensional Verification

Panel Processing

Panel Size

12" x 18"

Typical Lot Size

4, 6 or 12 panels

Delivery

3 - 5 weeks

4 - 5 weeks

5+ weeks