Products

General Capabilities

  • Fine Line Imaging - 50Ám pitch (25Ám Traces / 25Ám Spaces)
  • Microvias - 25Ám - 100Ám laser thru-vias
  • Polyimide thickness – 12.5Ám - 75Ám
  • Flex Base Material (Adhesive-less)
    • Sputtered Base Material (2Ám-18Ám Cu thickness – 12.5,25,50Ám Polyimide)
    • Espanex (9,12,18,25,35Ám Cu thickness – 12.5,25,50Ám Polyimide)
    • Dupont AP, Kapton E,H (5,9,12,18,35Ám Cu thickness – 25,50Ám Polyimide)
    • Panasonic, Upilex, and other Asian materials
  • Metal Layer Count - 1 to 4 layers
  • Soldermask LPI Capability - 20Ám - 75Ám (Halogen free)
  • Coverlay and Adhesive thicknesses – 12.5Ám - 75Ám
  • UV and Co2 Laser capability
  • Surface Plating
    • Electroless Cu
    • Electrolytic Cu
    • Electrolytic Nickel and Gold plating (Soft)
    • ENIG – Electroless Ni – Immersion Gold
    • HASL (Hot air solder leveling)
    • Immersion Tin
    • Immersion Silver
    • Organic Solderability Preservative
  • Value Added Processing
    • Component Assembly – Lead free solder
    • Stiffeners and Reinforcement
    • RFI shielding and Grounding (noise reduction)
    • Partnered with local CM’s (contract manufacturing)

Services

Process Parameters

Drilling Mode

Thru and Blind via drilling of Copper and Polyimide material

Via Diameter

20Ám - 200Ám

Hole Position Accuracy

±25Ám

Tooling Plate

Precision Vacuum plate w / Multi line pin system

Laser Types

UV Laser 355nm, diode-pumped, all solid-state
CO2 Laser, 9600nm, Sealed, RF-excited, super-pulsed

Capabilities Road Map

Basic

Advanced

R&D

Comments

Imaging

Min Pitch -
Trace / Space

100Ám - 50Ám / 50Ám

75Ám - 38Ám / 38Ám

60Ám - 30Ám / 30Ám

Copper Thickness Dependant

Smallest Feature

75Ám - 50Ám

35Ám

25Ám

 

Pad to Via Ratio

5 : 1

4 : 1

3 : 1

 

Registration
Layer 1 to Layer 2

< 100Ám

< 80Ám

< 70Ám

 

Microvias

Via Size

100Ám - 75Ám

50Ám

25Ám

Copper Thickness Dependant

Layers

1-2 Layers

3-4 Layers

4-5 Layers

Thru Via Only

Materials

Plated Copper

3Ám - 50Ám

2Ám - 50Ám

2Ám - 50Ám

 

Copper Thickness

ED 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

ED 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

ED 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

RA only if req'd

Polyimide

12Ám, 25Ám,
50Ám 75Ám 125Ám

12Ám, 25Ám,
50Ám 75Ám 125Ám

12Ám, 25Ám,
50Ám 75Ám 125Ám

 

Acrylic Adhesive

12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

 

Pyralux Coverlay Film

12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

 

Soldermask - DSFM

25Ám - 50Ám

20Ám - 25Ám

15Ám - 20Ám

 

Stiffeners

FR4, Polyimide, BT

FR4, Polyimide, BT

FR4, Polyimide, BT

 

Multilayer

Active Layers

1-2 Layers

3-4 Layers

4-5 Layers

 

Layer to Layer Tolerance

100Ám - 75Ám

75Ám - 60Ám

50Ám - 35Ám

 

Via Type

Thru

Thru

Thru

 

Plating

Electroless Copper

> 75Ám via

> 50Ám via

> 25Ám via

 

Electrolytic Copper

> 4Ám to desired thickness

> 2Ám to desired thickness

> 2Ám to desired thickness

 

Electrolytic Nickel

to desired thickness

to desired thickness

to desired thickness

 

Electrolytic Soft Gold (wire bondable)

to desired thickness

to desired thickness

to desired thickness

 

Selective Plating on (Cu, Ni, Au)

Yes

Yes

Yes

 

Electrolytic Tin

to desired thickness

to desired thickness

to desired thickness

 

ENIG -
Electroless Nickel / Immersion Gold

Yes

Yes

Yes

 

HASL

Yes

Yes

Yes

 

Singulation

Steel Rule Die (SRD) Tolerances

▒ 125Ám

▒ 125Ám

▒ 125Ám

 

UV and Co2 Laser Machining Tolerances

75Ám-50Ám

50Ám-38Ám

38Ám-25Ám

Thickness Dependant

Slits / Slots / Small Features

75Ám-50Ám

50Ám-38Ám

38Ám-25Ám

Thickness Dependant

Laser Processing

Co2 Laser / Plasma Etching

Polyimide / Adh.
12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

12Ám, 25Ám, 50Ám

 

Polyimide Etching - Chemical

2010

2010

2010

 

Assembly

HASL

Yes

Yes

Yes

 

Connectors

Yes

Yes

Yes

 

Lead Free Solder

Yes

Yes

Yes

 

Passive Components

Yes

Yes

Yes

 

Stiffeners / Reinforcement

FR4, BT, Kapton

FR4, BT, Kapton

FR4, BT, Kapton

 

Shielding

Cu 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

Cu 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

Cu 5Ám, 9Ám,
12Ám, 18Ám, 25Ám

 

Folding / Pre-Assembly

Yes

Yes

Yes

 

Quality

Visual Inspection

Up to 50x

Up to 50x

Up to 50x

 

Auto Optical Inspection (AOI)

2010

2010

2010

 

Electrical Test

Yes

Yes

Yes

 

X-Section

Yes

Yes

Yes

 

Optical Measurement System

▒ 10Ám

▒ 5Ám

▒ 5Ám

Automated Dimensional Verification

Panel Processing

Panel Size

12" x 18"

12" x 18"

12" x 18"

 

Typical Lot Size

4, 6 or 12 panels

4, 6 or 12 panels

4, 6 or 12 panels

 

Delivery

3 - 5 weeks

4 - 5 weeks

5+ weeks